Products
PELCO FlipScribe
Precision Back Side Scribing for all Materials
The PELCO® FlipScribe® (formerly from LatticeGear™) takes scribing to a new performance level, making clean, straight scribe lines on the back side to allow the user to accurately cleave front side targets, bonded wafers, glass, sapphire and other substrates.
It integrates a robust diamond scribe into a sample platform with a fence guide design. The time required to align and scribe is about 1 minute. It allows users to accurately position the scribe mark relative to features on the front side, visualized either by eye or with a user-supplied high magnification microscope.
The PELCO®FlipScribe® also offers a quick method for cleanly downsizing large area samples, by the use of a “scribe stop” which allows the operator to define the length of the scribe.
The PELCO® FlipScribe® is a compact, stable, accurate, fast and low cost scribing and cleaving solution suitable for any lab; no utilities are required for its operation.
Features
- Enables accurate cleaving through front side targets with a scribe made on the back side of the substrate
- Avoids damaging the front side of the sample
- Achieves an accuracy of ±200μm
- Maintains a flexibility with respect to sample size and shape
- Allows the length of the scribe to be varied from 1 to 100mm
- Enables precise and repeatable sample alignment and sizing with a ruler embedded in platform
- Retains a capability of scribing bonded crystalline and amorphous wafers and chips for subsequent cleaving
Operation
The sample is placed face up on the bed of the PELCO® FlipScribe®, with the left rail being used to set the position of the scribe and being locked in place.
The depth and angle of the scriber tip is adjustable, with the optimal depth and angle depending on the sample type. The stop is set to prevent the blue bar from impacting the sample, and the sample is drawn over the scriber tip to make the scribe.
A variety of sample holders are available with many form factors including standard wafer sizes, down to individual small dies. After scribing, the cleave is made using cleaving pliers.
Technical Note
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Download Technical Note |
| Art. | Description | Unit | Price | Quantity | |
|---|---|---|---|---|---|
| 54330 | PELCO FlipScribe Back-Side Scribing Tool |
Each | € 5.901,40 | ||
| 54331 | PELCO FlipScribe Extension for Scribing Large Samples |
Each | € 254,30 | ||
| 54332 | PELCO FlipScribe Holder for Small Samples from 5-25mm, 200-800 microns in thickness |
Each | € 234,70 | ||
| 54333 | PELCO FlipScribe Kit for Sample Holding |
Each | € 1.772,20 | ||
| 54334 | PELCO FlipScribe Sample Holder for 2″ Wafers |
Each | € 488,90 | ||
| 54335 | PELCO FlipScribe Sample Holder for 3″ Wafers |
Each | € 488,90 | ||
| 54336 | PELCO FlipScribe Sample Holder for 4″ Wafers |
Each | € 488,90 | ||
| 54337 | PELCO FlipScribe Sample Holder for 45 rotated lithography |
Each | € 488,90 |
