ion milling, cross-sectioning

This is a nonconductive, two-component, solvent-thinned, epoxy-phenolic adhesive for high performance applications.
Chemically resistant and provides a thin layer of glue which has good ion milling properties.
It has low viscosity and is extremely thin, with minimum creep, hysteresis and linearity problems.

Solids content is 22%.
It is an excellent adhesive for mounting samples for TEM dimpling and bonding of samples to TEM grids for imaging or FIB.

Operating temperature range, short term is -269 to +370 C; long term, -269 to +260 C.
Elongation can occur at +24 C (3%). This may be the widest temperature range general-purpose adhesive that is available.

A kit contains:

• 4 bottles (14g each) Resin
• 4 bottles (11g each) Curing Agent
• 4 brush caps for dispensing mixed adhesives
• 4 disposable mixing funnels and instructions.

MSDS

Download Material Safety Data Sheet – 16039 Adhesive

Download Material Safety Data Sheet – Curing Agent