PELCO Colloidal Silica Suspensions

PELCO Colloidal Silica Suspensions are ideal for the final polishing of materials for which a high quality, visibly scratch free surface is required.
Three new formulations are provided, each with a specific average particle size and with increased alkalinity for an enhanced Chemical-Mechanical Polishing (CMP) effect.

PELCO Colloidal Silica CS1 with an average particle size of 80nm and pH value of 9.9 is ideal for many metallographic final polishing applications.
PELCO Colloidal Silica CS2 with an average particle size of 50nm and pH value of 9.9 formulated for fine polishing of semiconductor wafers and devices.
PELCO Colloidal Silica CS3 with an average particle size of 35nm and pH value of 10.5 formulated specifically for fine polishing of silicon wafers and devices.