Related products
Microsaw

 

Microsaw

Model MS 3

Precise cutting under stereo microscope

  • Precise
  • Small
  • Easy-to-use

Microheat

 

Microheat Thermoplastic gluing under stereo microscope

Model MH 2

Thermoplastic gluing under stereo microscope

  • Heat-stabilized
  • Small
  • Ideal for thermoplastic gluing

 

Micropol

 

Micropol polisher

Polisher for TEM & Metallography Model MC 2

  • Rugged, corrosion proof construction
  • Variable speed control for precision polishing
  • Quick change bayonet mount bowls
  • Timer for automatic operation
  • Extremely light load for fragile TEM samples

Micropol micropolisher

 

SEM ion mill model SC-1000

The today’s advanced SEM investigations require high-quality, artifact-free SEM samples of minimal amount of damage on their surface. The new Technoorg SC-1000 SEM Sample Preparation System built on proven ion beam milling technique provides sample surfaces that totally meets these requirements.

The SC-1000 model is equipped both with high- and low-energy ion sources. Rapid slope cutting with the high-energy ion gun followed by gentle surface cleaning with the low-energy ion gun provides cross-sectional SEM samples suitable for semiconductor failure analysis and other analytical purposes. The system also provides an ion milling based solution for improving and cleaning of mechanically polished SEM samples and preparation of damage-free surfaces for EBSD technique.

FEATURES

  • Cross-sectional sample preparation by slope cutting in 90, 60, 45 and 30 by different sample holders
  • Final polishing and cleaning of traditional SEM and EBSD samples
  • High-energy ion gun for rapid milling Low-energy ion gun for gentle surface polishing and cleaning
  • Automated parameter settings and operation
  • Sample rotation and oscillation
  • Site-specific sample preparation with high-precision positioning
  • Real-time monitoring of the milling process by high-resolution CCD camera and TFT monitor

td>

Specification

Ion sources: two ion guns: focused high-energy ion gun operating from 2keV to 10keV
    focused low-energy ion gun in the range of 100eV to 2keV
    continuously and independently adjustable milling energy
  beam current density: max. 100mA/cm² for focused high-energy ion gun
    max. 10mA/cm² for focused low-energy ion gun
  sputtering rate: 150 μm/hour on Si at 30º for focused high-energy ion gun
    28 μm/hour on Si at 30º for focused low-energy ion gun
Sample stage: sample size: slope cutting sample holder (available with 30o, 45o, 60o, 90o tilted platforms)
           for 30°, 45°, 60° holders: max. 20 mm (l) x 16 mm (w) x 7 mm (th)
           for 90° holder: max. 20 mm (l) x 16 mm (w) x 5.5 mm (th)
    sample holder for surface cleaning (EBSD) using 3 different head type:
           flat head type: max. Ø36 mm x 0-5.5 mm
           standard type: max. Ø26 mm x 3-14 mm
           hollow type: max. Ø24 mm x 13-23 mm
  sample positioning: high precision sample positioning for slope cutting: with 2 μm accuracy
  sample tilting: 0º to 30º in 0.1º increments
  sample rotation: in-plane rotation, 360º
  sample oscillation: in-plane oscillation from +10 to +90º
     
Vacuum system: oil-free diaphragm and turbomolecular pumps with combined (Pirani/Penning) vacuum gauge
     
Gas supply system: 99.999% purity argon  
  high-precision working gas flow control with motorized needle valve
     
Imaging system: high resolution CMOS camera with manual zoom video lens of 50-400x magnification
     
Computer control: easy-to-use graphical interface, automated ion source setup, milling parameter setting and operation control