Model MS 3
Precise cutting under stereo microscope
- Precise
- Small
- Easy-to-use
Model MH 2
Thermoplastic gluing under stereo microscope
- Heat-stabilized
- Small
- Ideal for thermoplastic gluing
Polisher for TEM & Metallography Model MC 2
- Rugged, corrosion proof construction
- Variable speed control for precision polishing
- Quick change bayonet mount bowls
- Timer for automatic operation
- Extremely light load for fragile TEM samples
The today’s advanced SEM investigations require high-quality, artifact-free SEM samples of minimal amount of damage on their surface. The new Technoorg SC-1000 SEM Sample Preparation System built on proven ion beam milling technique provides sample surfaces that totally meets these requirements.
The SC-1000 model is equipped both with high- and low-energy ion sources. Rapid slope cutting with the high-energy ion gun followed by gentle surface cleaning with the low-energy ion gun provides cross-sectional SEM samples suitable for semiconductor failure analysis and other analytical purposes. The system also provides an ion milling based solution for improving and cleaning of mechanically polished SEM samples and preparation of damage-free surfaces for EBSD technique.
FEATURES
- Cross-sectional sample preparation by slope cutting in 90, 60, 45 and 30 by different sample holders
- Final polishing and cleaning of traditional SEM and EBSD samples
- High-energy ion gun for rapid milling Low-energy ion gun for gentle surface polishing and cleaning
- Automated parameter settings and operation
- Sample rotation and oscillation
- Site-specific sample preparation with high-precision positioning
- Real-time monitoring of the milling process by high-resolution CCD camera and TFT monitor
Specification |
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|---|---|---|
| Ion sources: | two ion guns: | focused high-energy ion gun operating from 2keV to 10keV |
| focused low-energy ion gun in the range of 100eV to 2keV | ||
| continuously and independently adjustable milling energy | ||
| beam current density: | max. 100mA/cm² for focused high-energy ion gun | |
| max. 10mA/cm² for focused low-energy ion gun | ||
| sputtering rate: | 150 μm/hour on Si at 30º for focused high-energy ion gun | |
| 28 μm/hour on Si at 30º for focused low-energy ion gun | ||
| Sample stage: | sample size: | slope cutting sample holder (available with 30o, 45o, 60o, 90o tilted platforms) |
| for 30°, 45°, 60° holders: max. 20 mm (l) x 16 mm (w) x 7 mm (th) | ||
| for 90° holder: max. 20 mm (l) x 16 mm (w) x 5.5 mm (th) | ||
| sample holder for surface cleaning (EBSD) using 3 different head type: | ||
| flat head type: max. Ø36 mm x 0-5.5 mm | ||
| standard type: max. Ø26 mm x 3-14 mm | ||
| hollow type: max. Ø24 mm x 13-23 mm | ||
| sample positioning: | high precision sample positioning for slope cutting: with 2 μm accuracy | |
| sample tilting: | 0º to 30º in 0.1º increments | |
| sample rotation: | in-plane rotation, 360º | |
| sample oscillation: | in-plane oscillation from +10 to +90º | |
| Vacuum system: | oil-free diaphragm and turbomolecular pumps with combined (Pirani/Penning) vacuum gauge | |
| Gas supply system: | 99.999% purity argon | |
| high-precision working gas flow control with motorized needle valve | ||
| Imaging system: | high resolution CMOS camera with manual zoom video lens of 50-400x magnification | |
| Computer control: | easy-to-use graphical interface, automated ion source setup, milling parameter setting and operation control | |