Specifications |
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Sputter head | Low voltage planar magnetron Quick target change Wrap-around dark-space shield Shutter for target conditioning |
Target: | Cr, Pt/Pd (standard) or IR (Iridium coater) optional: Au, Au/Pd, Cu, Ni, Pd, Pt, Ta, Ti and W |
Sputter supply: | Microprocessor based Safety interlock Constant current control independent of vacuum Digitally selectable current (20, 40, 60 or 80mA) |
Chamber size: | 150mm OD Variable height, 165 - 250mm including glass cylinder (65mm H and 2 metal spacer rings) |
Sample stage: | Non-repetitive rotary, planetary motion with manual tilt 0-90° Variable speed rotation Crystal head 4 sample holders (specify when ordering, see Sample Holders) |
Analog metering: | Vacuum Atm - .001mb Current 0-100mA |
Control method: | Automatic operation of gas purge and leak functions Automatic process sequencing Digital timer (0-300 sec) with pause Automatic venting |
Thickness control: | controller with terminating facility |
Pumping system |
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Configuration: | Turbo drag / rotary pump combination Optional dry scroll pump instead of rotary pump |
Pumping speed: | 1 min to 1 x 10-3mb |
Pumpdown Time: | 500VA (coater and pumping system together) |
Ultimate pressure | 1 x 10-5mb |
Desktop system: | Rotary pump is mounted on desktop compatible anti-vibration table All metal vacuum coupling system |
Thickness Controller |
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B7384: | Microprocessor based 4 digit display, push button zero 6MHz crystal with lifetime check 5 times/sec update rate ( more information) |
Thickness range: | 0.0 - 999.9nm |
Resolution: | Better than 0.1nm |
Density range: | 0.50 - 30.00gm/cm3 |
Tooling factor range: | 0.25 - 8.00 |
Termination range: | 0 - 999.9nm |
Services Required |
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Electrical: | 200-240VAC, 50/60Hz |
Power: | 550VA max. |
Argon gas: | Purity, min. 99.995% Pressure regulated 5 - 6 psi (0.4 bar) Hose connection, 6.0mm (1/4") ID hose |
System Dimensions |
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Size: | Width 600mm, Depth 600mm, Height 450mm (with rotary pump) |
Weight: | 40kg (with rotary pump) |