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Sputter head Low voltage planar magnetron 
Quick target change 
Wrap-around dark-space shield 
Shutter for target conditioning 
Target: Cr, Pt/Pd (standard) or IR (Iridium coater)
optional: Au, Au/Pd, Cu, Ni, Pd, Pt, Ta, Ti and W
Sputter supply: Microprocessor based 
Safety interlock 
Constant current control independent of vacuum
Digitally selectable current (20, 40, 60 or 80mA)
Chamber size: 150mm OD
Variable height, 165 - 250mm including glass cylinder (65mm H and 2 metal spacer rings)
Sample stage: Non-repetitive rotary, planetary motion with manual tilt 0-90° 
Variable speed rotation 
Crystal head 
4 sample holders (specify when ordering, see Sample Holders)
Analog metering: Vacuum Atm - .001mb 
Current 0-100mA
Control method: Automatic operation of gas purge and leak functions 
Automatic process sequencing 
Digital timer (0-300 sec) with pause 
Automatic venting
Thickness control: controller with terminating facility

Pumping system

Configuration: Turbo drag / rotary pump combination 
Optional dry scroll pump instead of rotary pump
Pumping speed: 1 min to 1 x 10-3mb
Pumpdown Time: 500VA (coater and pumping system together)
Ultimate pressure 1 x 10-5mb
Desktop system: Rotary pump is mounted on desktop compatible anti-vibration table 
All metal vacuum coupling system

Thickness Controller

B7384: Microprocessor based 
4 digit display, push button zero 
6MHz crystal with lifetime check 
5 times/sec update rate ( more information)
Thickness range: 0.0 - 999.9nm
Resolution: Better than 0.1nm
Density range: 0.50 - 30.00gm/cm3
Tooling factor range: 0.25 - 8.00
Termination range: 0 - 999.9nm

Services Required

Electrical: 200-240VAC, 50/60Hz
Power: 550VA max.
Argon gas: Purity, min. 99.995% 
Pressure regulated 5 - 6 psi (0.4 bar) 
Hose connection, 6.0mm (1/4") ID hose

System Dimensions

Size: Width 600mm, Depth 600mm, Height 450mm (with rotary pump)
Weight: 40kg (with rotary pump)